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2017 TWS International Users Conference Agenda

The 2017 Third Wave Systems International Users Conference came to a close May 18 after two days of great presentations from our users, an unforgettable networking event at the Indianapolis Motor Speedway and educational breakout sessions. 

Next year, the 2018 Third Wave Systems International Users Conference will be held at DoubleTree Hotel in Cleveland, Ohio. We already have a lineup of speakers being built and we will host our offsite networking event at the legendary Rock & Roll Hall of Fame. We will have more information regarding next year’s conference this fall. 

Be sure to visit TWS at the EMO show in Hannover, Germany this September where TWS will be exhibiting alongside its partner, ISBE GmbH.

2017 CONFERENCE PRESENTERS

    • Dr. Tom Childs, Professor Emeritus of Manufacturing Engineering, University of Leeds
      “Simulating titanium alloy Ti6Al4V  chip formation over a wide range of cutting speeds”
    • Mr. John Marshall, Director of Engineering, PCC Aerospace
       “Relevant Application of Production Module within Industry 4.0”
    • Dr. Rob Ivester, Deputy Director, U.S. Department of Energy
       “Energy and Manufacturing in America”
    • Dr. Frank Pfefferkorn, Associate Professor & Mr. Sinan Kesriklioglu, Ph.D. Student, University of Wisconsin-Madison
      “Tool-Chip Interface Temperature Measurement with Thermocouple Fabricated Directly on the Rake Face”
    • Mr. Brian Rohm, Lead Manufacturing Engineer, GE Aviation
      “Utilizing Production Module for LEAP Production”
    • Mr. Jeff Tessier, Senior Manufacturing Engineer, DePuy Synthes
      “Where’s the Chip?”
    • Mr. Shi Chen, Manager of Product Engineering Turning, Kennametal
      “Third Wave Systems FEA in Produce Development”
    • Dr. Jarred Heigel, Mechanical Engineer, NIST
      “Hybrid Manufacturing and the Challenges of Machining Additively Manufactured Parts”

 

Mr. Brian Rohm from GE Aviation presenting on how GE is using Production Module for their LEAP engine production.

Mr. Brian Rohm from GE Aviation presenting on how GE is using Production Module for their LEAP engine production.

Unforgettable! On Wednesday the attendees went offsite to the Indianapolis Motor Speedway where the cars were running time trails in preparation for the Indy 500.

Unforgettable! On Wednesday the attendees went offsite to the Indianapolis Motor Speedway where the cars were running time trails in preparation for the Indy 500.

Mr. Sinan Kesriklioglu from the University of Wisconsin-Madison presented a thought-provoking presentation titled, “Tool-Chip Interface Temperature Measurement with Thermocouple Fabricated Directly on the Rake Face”

Mr. Sinan Kesriklioglu from the University of Wisconsin-Madison presented a thought-provoking presentation titled, “Tool-Chip Interface Temperature Measurement with Thermocouple Fabricated Directly on the Rake Face.”

 

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